1.5mm FR4 epoxy, 35 μm CU on both sides Plated drill holes, O 1mm Soldering and component side surfacemAde of chem
nickel/gold (Ni/Au) and soldermAsk Pre-scored breaking points for detaching individual modules from the board Size 72.6×76.2mm Adaption board for 14 different SMD TSOP I and 7 different SMD TSOP II chips