Non-European Format Size: 114.3 x 165.1 mm Material thickness: 1.6 mm FR4 Copper coating 35 μm, hot dip tin-plated on soldering side only (HAL) Component overlay on component side Hole pattern: 2.54 x 2.54 mm (1//20") 40 x 60 bore hole rows 3-hole soldering islands 4 DIP IC rows, 7.62 mm sequence, 15.24 mm with 48 connections Hole diameter: 1.02 mm Max